At the 2019 Mobile World Congress and before there were several announcements about storage products for mobile devices (esp. phones). We also include a recent embedded solid state drive announcement.
In late January Samsung announced a 1 TB eUFS chip with Ball Grid Array connections for circuit boards. The device combines 16 layers of die (512Gb V-NAND flash memory) stacked on top of each other and includes a proprietary Samsung controller. The product is said to offer up to 1 GB/s sequential read speed. The company said that this is 10 X the speed of a typical microSD card. Random read speed has increased by up to 38% over the company’s prior 512 GB version at up to 58K IOPs. Random writes at up to 50K IOPS. The company said that this allows for high-speed continuous shooting at 960 frames per second and allow full use of multi-camera capabilities in today and tomorrow’s mobile products.
SanDisk and Micron both announced UHS-1 microSDXC storage cards at the 2019 Mobile World Congress. These cards will likely cost in the $400+ range for a while, while 512GB SanDisk cards currently sell for about $200.
SanDisk (part of Western Digital) announced its 1 TB microSD cards at the 2019 MWC announced that it will have 1TB microSD cards available by the second quarter of 2019. It is likely that this product is using 96-layer quad-level cell (QLC) 3D NAND flash. The SanDisk card supports read speeds at 160 MB/s and writes at 90 MB/s.
Micron also introduced a 1 TB (c200) microSD card at the 2019 MWC. It also plans to launch the product using 96-layer QLC 3D NAND flash in the second quarter of 2019. Micron card’s read speed is 100 MB/s and write speed is 95 MB/s. Both the SanDisk and Micron products meet the A2 mobile card standard, this allows them to be used for applications although they will likely be used mostly for bulk storage. Micron has not yet announced a price for these cards.
Micron reported working with Qualcomm to enable a 5G automotive platform for next generation vehicles. According to the company release, “The new Qualcomm® Snapdragon™ Automotive 5G Platform will feature a custom Micron 149 ball count multichip package, allowing for speeds of up to 20 times faster than current LTE-Advanced modems. Faster modem speeds widen the possibilities for vehicles to connect to other vehicles, roadside infrastructure and beyond.”
Micron says that it created a portfolio of ultra-small 8x9.5mm, 149 ball count multichip package (MCP) solutions with SLC NAND plus LPDDR4 rated at automotive temperature grade to pair with the Snapdragon Automotive 5G Platform, creating opportunities for immersive in-vehicle experiences and automotive safety.
In related news, Greenliant expanded its industrial temperature SATA ArmourDrive offerings with 2.5-inch, M.2 2242 and CFast form factor products. The company says that the New ArmourDrive SSDs can be used in a variety of embedded systems that require reliable, rugged and removable data storage. These new products join mSATA and SATA M.2 2280 in Greenliant’s ArmourDrive family of industrial temperature (-40°C to +85°C) SSDs that are capable of withstanding extreme environments.
Storage and memory in mobile devices, combined with advanced AI for real-time decision making, early 5G network activites and higher resolution images will drive demand for storage capacity on mobile devices.
In late January Samsung announced a 1 TB eUFS chip with Ball Grid Array connections for circuit boards. The device combines 16 layers of die (512Gb V-NAND flash memory) stacked on top of each other and includes a proprietary Samsung controller. The product is said to offer up to 1 GB/s sequential read speed. The company said that this is 10 X the speed of a typical microSD card. Random read speed has increased by up to 38% over the company’s prior 512 GB version at up to 58K IOPs. Random writes at up to 50K IOPS. The company said that this allows for high-speed continuous shooting at 960 frames per second and allow full use of multi-camera capabilities in today and tomorrow’s mobile products.
SanDisk and Micron both announced UHS-1 microSDXC storage cards at the 2019 Mobile World Congress. These cards will likely cost in the $400+ range for a while, while 512GB SanDisk cards currently sell for about $200.
SanDisk (part of Western Digital) announced its 1 TB microSD cards at the 2019 MWC announced that it will have 1TB microSD cards available by the second quarter of 2019. It is likely that this product is using 96-layer quad-level cell (QLC) 3D NAND flash. The SanDisk card supports read speeds at 160 MB/s and writes at 90 MB/s.
Micron also introduced a 1 TB (c200) microSD card at the 2019 MWC. It also plans to launch the product using 96-layer QLC 3D NAND flash in the second quarter of 2019. Micron card’s read speed is 100 MB/s and write speed is 95 MB/s. Both the SanDisk and Micron products meet the A2 mobile card standard, this allows them to be used for applications although they will likely be used mostly for bulk storage. Micron has not yet announced a price for these cards.
Micron reported working with Qualcomm to enable a 5G automotive platform for next generation vehicles. According to the company release, “The new Qualcomm® Snapdragon™ Automotive 5G Platform will feature a custom Micron 149 ball count multichip package, allowing for speeds of up to 20 times faster than current LTE-Advanced modems. Faster modem speeds widen the possibilities for vehicles to connect to other vehicles, roadside infrastructure and beyond.”
Micron says that it created a portfolio of ultra-small 8x9.5mm, 149 ball count multichip package (MCP) solutions with SLC NAND plus LPDDR4 rated at automotive temperature grade to pair with the Snapdragon Automotive 5G Platform, creating opportunities for immersive in-vehicle experiences and automotive safety.
In related news, Greenliant expanded its industrial temperature SATA ArmourDrive offerings with 2.5-inch, M.2 2242 and CFast form factor products. The company says that the New ArmourDrive SSDs can be used in a variety of embedded systems that require reliable, rugged and removable data storage. These new products join mSATA and SATA M.2 2280 in Greenliant’s ArmourDrive family of industrial temperature (-40°C to +85°C) SSDs that are capable of withstanding extreme environments.
Storage and memory in mobile devices, combined with advanced AI for real-time decision making, early 5G network activites and higher resolution images will drive demand for storage capacity on mobile devices.
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