As we move closer and closer to the end of the year, Qualcomm will hold an announcement possibly announcing the Snapdragon 865, which we’re definitely excited for. However, it looks like before the latter is officially unveiled, a potential name of its successor, the Snapdragon 875 Mobile Platform has come forth and is expected to be made in partnership with TSMC.
TSMC Already Commenced Risk Production This Year, With Its 5nm+ Manufacturing Process Slated for Mass Production in 2021
According to a fresh report published on Sina, a few details surrounding the Snapdragon 865 Mobile Platform have come forth. As most of you know, the company’s latest Exynos 9825 is made on the Korean giant’s significantly improved 7nm EUV process, and it looks like for the Snapdragon 865, Qualcomm has partnered with Samsung to use the same technology to mass production the upcoming chipset. For 2021, the report states that Qualcomm might return to TSMC for its 5nm node when it’s gearing to release the Snapdragon 875.
That is rather strange as Samsung announced back in April that it has successfully developed 5nm EUV nodes, resulting in a 20 percent reduced power draw. Whether or not the manufacturer continues to run into yield problems, we’ll find out in the future. A separate source claims that TSMC’s 5nm+ process will be ready for mass production in 2021, which could give Qualcomm additional confidence in re-collaborating with the chip manufacturing giant.
Additionally, TSMC’s 5nm design infrastructure is reportedly completed, giving lucrative clients such as Apple to experience the node’s benefits when rolling out its advanced A14 silicon, and it’s possible Qualcomm would have carried out some test runs too behind closed doors. Sadly, there were no other details shared regarding the Snapdragon 875, but the report does mention a few tidbits for the upcoming Snapdragon 865. Firstly, the latter will reportedly arrive in two variants, codenamed ‘Kona’ and ‘Huracan’, providing support for both LPDDR5x memory and UFS 3.0 storage.
It can be assumed for now that one version of the Snapdragon 865 will feature an integrated 5G baseband modem, while the other one won’t. This little detail was talked about earlier as well, meaning that manufacturers will have a choice whether to give their devices 5G connectivity support or not, depending on which markets that model will release in. The first of many Snapdragon 865 benchmarks look promising, revealing the SoC to have made modest gains over the Snapdragon 855.
Then again, it’s too early to draw up conclusions, and like always, we’ll recommend that you treat this info with a pinch of salt. Qualcomm is expected to announce new products in December later this year. Hopefully, we’ll get some clue as to what the company plans on doing for the Snapdragon 875.
TSMC Already Commenced Risk Production This Year, With Its 5nm+ Manufacturing Process Slated for Mass Production in 2021
According to a fresh report published on Sina, a few details surrounding the Snapdragon 865 Mobile Platform have come forth. As most of you know, the company’s latest Exynos 9825 is made on the Korean giant’s significantly improved 7nm EUV process, and it looks like for the Snapdragon 865, Qualcomm has partnered with Samsung to use the same technology to mass production the upcoming chipset. For 2021, the report states that Qualcomm might return to TSMC for its 5nm node when it’s gearing to release the Snapdragon 875.
That is rather strange as Samsung announced back in April that it has successfully developed 5nm EUV nodes, resulting in a 20 percent reduced power draw. Whether or not the manufacturer continues to run into yield problems, we’ll find out in the future. A separate source claims that TSMC’s 5nm+ process will be ready for mass production in 2021, which could give Qualcomm additional confidence in re-collaborating with the chip manufacturing giant.
Additionally, TSMC’s 5nm design infrastructure is reportedly completed, giving lucrative clients such as Apple to experience the node’s benefits when rolling out its advanced A14 silicon, and it’s possible Qualcomm would have carried out some test runs too behind closed doors. Sadly, there were no other details shared regarding the Snapdragon 875, but the report does mention a few tidbits for the upcoming Snapdragon 865. Firstly, the latter will reportedly arrive in two variants, codenamed ‘Kona’ and ‘Huracan’, providing support for both LPDDR5x memory and UFS 3.0 storage.
It can be assumed for now that one version of the Snapdragon 865 will feature an integrated 5G baseband modem, while the other one won’t. This little detail was talked about earlier as well, meaning that manufacturers will have a choice whether to give their devices 5G connectivity support or not, depending on which markets that model will release in. The first of many Snapdragon 865 benchmarks look promising, revealing the SoC to have made modest gains over the Snapdragon 855.
Then again, it’s too early to draw up conclusions, and like always, we’ll recommend that you treat this info with a pinch of salt. Qualcomm is expected to announce new products in December later this year. Hopefully, we’ll get some clue as to what the company plans on doing for the Snapdragon 875.
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